Inverter_Power PCB is sent to production (21-03-2024). PCB specifications:

Base Material: FR-4
Layers: 4
Dimensions: 200 mm * 150 mm
PCB Thickness: 1.6 mm
Via Covering: Plugged
Surface Finish: ENIG 1U"
Outer Copper Weight: 2 oz (70um)
Inner Copper Weight: 2 oz (70um)
Remark: 1.10mm HOLES ARE FOR PRESS-FIT PART. USE (47.2MIL +/- 1MIL) DRILLED HOLES WITH A COPPER THICKNESS IN HOLE OF 25-50UM.

Inverter_Control PCB is sent to production (21-03-2024). PCB specifications:

Changelog:

Inverter_Power

D1 is not correctly rated. Replace with appropiate PMOS or beefier Schottky (beware the voltage drop)
Rdis does practically nothing compared to R504 .. R510 and could be eliminated.
Missing decoupling capacitors near semiconductor DC+ and DC- terminals. Proposed reference is 2220Y1K00104KZT, 2 for each module.
R301 can be of lower value.
Most DNP caps are actually needed.
D501 failed once, but cause remains unknown.
R501 should have a bigger value.
R511 and R512 should have a small tolerance, and it should be specified in the schematic.
10uF 50V 0805 caps are expensive and should be replaced with 10uF 50V 1206 or 10uF 50V 1210.
Managed to somehow displace a press-fit RedCube terminal, so copper thickness in via and/or surface finish is probably not good. Check with manufacturer, and try to match Wurth Elektronik's and Wolfspeed's specifications.

DCDC101 not tested yet.
L101 has a very low current rating. Choose new part with a rating of at least 3A.
Q101 and USB in general not tested yet.
U501 not working as expected.
MCU dot in silkscreen might be misleading. Check the orientation very carefully.
3.3V OVP should be added to all non-5V-tolerant MCU pins.
Most if not all 15R resistors could very well be 0R or solder bridges.
10uF 50V 0805 caps are expensive and should be replaced with 10uF 50V 1206 or 10uF 50V 1210.

Inverter_Power PCB is sent to production (15-02-2024). PCB specifications:

Base Material: FR-4
Layers: 4
Dimensions: 200 mm * 150 mm
PCB Thickness: 1.6 mm
Via Covering: Plugged
Surface Finish: ENIG 1U"
Outer Copper Weight: 2 oz (70um)
Inner Copper Weight: 2 oz (70um)
Minimum via hole size: 0.2mm
Minimum clearance / track width: 0.2mm
Remark: 1.10mm HOLES ARE FOR PRESS-FIT PART. USE (47.2MIL +/- 1MIL) DRILLED HOLES WITH A COPPER THICKNESS IN HOLE OF 25-50UM.

Inverter_Control PCB is sent to production (21-02-2024). PCB specifications:

Errors already acknowledged:

Inverter_Power should have been manufactured with Chemical Tin (Inmersion Tin) for the press-fit pins. ENIG is alright from what I have researched, but not the best for the contact life.
In Inverter_Power' silkscreen, THE + AND - MARKS ARE REVERSED, BE CAREFUL
In Inverter_Power, LDOs' pins 4 and 5 are swapped and need a dead-bug style rework for the LDOs to work according to design.
Inverter_Power does not have any supply protection, and it really should.
In Inverter_Control, BOOT0 (pin 94 of the MCU) should be connected to GND using a 10kR or similar value resistor.
In Inverter_Control, EEPROM I2C nets should be pulled up using a value extracted from here. The testpoints TP292 and TP293 can be used for this purpose.
Inverter_Control features a supply filter in the 20-30V bus, which could be better placed in the 5V bus.
In Inverter_Control, Vbat must be connected to 3.3V