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Feature Suggestion - Through vias instead of blind/buried #61

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Sleepyboi7973 opened this issue Mar 1, 2024 · 3 comments
Open

Feature Suggestion - Through vias instead of blind/buried #61

Sleepyboi7973 opened this issue Mar 1, 2024 · 3 comments
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@Sleepyboi7973
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Blind/buried vias are a significant price increase compared to through vias, would be nice to have the option if possible

@cooked
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cooked commented Mar 1, 2024

totally agree. some work is in progress in the new_vias branch... currently organizing vias along the tg direction, but also radially would work
image

@cooked cooked self-assigned this Mar 1, 2024
@cooked cooked added the new New feature or request label Mar 1, 2024
@algocrypto
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Hi there,
I am having the same issue from JLCPCB -->
.It seems that there are buried or blind via in your file and we don’t make PCB that with buried or blind via.
Is there any fix for these buried or blind via, can we fix it manually?

@cooked
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cooked commented Apr 29, 2024

Hi @algocrypto,
I merged the new vias into master. No more buried vias, although there might be issue with the annular ring width still (I plan to tackle that next, having the algorithm to pick-up track width and clearance from the board settings).

This is how it looks for a 8-layer widing (the inner layers might still have some cosmetics issues where the end of the coil is not properly trimmed down, but that should not impact functionality)

image

image

Let me know how it works for you.

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